Amkor Technology | 美體產業公開資訊

查看AmkorTechnology,Inc.(AMKR)的公司概況，包括業務摘要、行業/板塊資訊、員工人數、企業管治、高級行政人員及其薪酬。

截止 2020年12月31日為止計算的金額，現金賠償則計算至上一個財政年度末止。薪資是指薪俸、獎金等。已行使價是指財政年度期間已行使的期權價值。貨幣為 USD。

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages th...