Flip Chip - Die Attach | 美體產業公開資訊

Die Attach. Besi offers a wide range of die attach systems based on leading-edge technology. The offering includes multi-chip bonders for advanced packaging, ... Read More

Die Bonding. In back-end semiconductor manufacturing, the die attach process ... Read More

However, the continuously increasing requirements of today's applications set high standards in die bonding. Besi's die attach equipment is based on unique and ... Read More

The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with ... Read More

Besi offers flip chip systems for mass production as well as for the high-end ... Read More

The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach ... Read More

Soft Solder Die Bonding. Besi Switzerland is a globally leading designer and ... Read More

Besi offers a wide range of die attach systems based on leading-edge technology ... Read More

Esec 2100 DS, the flexible and fast high temperature Die Bonding Platform for Leadframe Applications. The latest member of the field proven standard machine​ ... Read More