創意電子 | 美體產業公開資訊

2014年05月，我們很榮幸的正式對外宣布，.DDR4矽智財（IP）採用台積電16奈米鰭式.場效電晶體（FinFET）製程技術，並成功通過.晶片驗證，為創意第1個16 ...

Press Release

Hsinchu, Taiwan – March 10, 2022 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces the availability of a platform to shorten design cycles and for low risk, high yield production of ASICs adopting TSMC 2.5D and 3D Advanced Packaging Technology (APT). The platform supports TSMC’s CoWoS-S, CoWoS-R, and InFO technologies. GUC provides a total solution: silicon-proven interface IPs, CoWoS® and InFO silicon-correlated design, signal and power integrity, thermal simulation flows, and high volume product proven DFT and production tests.   GUC has many years of high-volume production experience of CoWoS-S (silicon interposer) products with HBM using in-house and 3rd party PHY and Controller IPs. InFO design and simulation flows were silicon-correlated using ...