Datacon 2200 evo | 美體產業公開資訊
Equippedwithintegrateddispenser,12”waferhandling,automatictoolchanger, ...
The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products.
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Besi | 美體產業公開資訊
BE Semiconductor Industries N.V. (Besi) develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging ... Read More
Datacon 2200 evo | 美體產業公開資訊
Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, ... Read More
Datacon 2200 evo plus | 美體產業公開資訊
Datacon 2200 evo ... The Datacon 2200 evo plus die bonder for Multi Module ... Read More
Datacon 2200 evo hS | 美體產業公開資訊
The Datacon 2200 evo hS die bonder for Multi Module Attach assembles all ... Read More
Flip Chip | 美體產業公開資訊
Besi offers flip chip systems for mass production as well as for the high-end ... Read More
Datacon 8800 CHAMEO advanced | 美體產業公開資訊
The Datacon 8800 CHAMEO advanced bonder raises a field proven platform ... fit for chip attach of any WL-FOP process, supporting both face-down (flip mode) ... Read More
Products & Technology | 美體產業公開資訊
Products & Technology ... Besi is a leading supplier of semiconductor assembly ... Read More
Datacon 2200 evo advanced | 美體產業公開資訊
Accuracy & Flexibility for your mass production. The new Datacon 2200 evo ... Read More
Die Attach | 美體產業公開資訊
Besi offers a wide range of die attach systems based on leading-edge ... Read More
Besi Singapore Pte. Ltd. | 美體產業公開資訊
【徵才職缺】Software Test Engineer、Software Engineer、Customer Service & Application Engineer【公司簡介】5 個工作職缺、資本額：2000萬元、員工 ... Read More
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風雷益有限公司統編多少?統編:80308229
公司名稱:風雷益有限公司統一編號:80308229所在縣市:新北市所在區域:淡水區詳細地址:淡金路2段391號7樓公司狀態:解散