Home | 美體產業公開資訊

關於創意電子.公司資訊·經營團隊·公司簡介影片.新聞室.新聞稿·創意聚焦·業界活動.企業社會責任.企業社會責任政策·公司治理·負責任商業聯盟(RBA)成員.

Press Release

GUC Tapes Out Complex 3D Stacked Die Design on Advanced FinFET Node Using Cadence Integrity 3D-IC Platform https://www.cadence.com/zh_TW/home/company/newsroom/press-releases/pr/2023/guc-tapes-out-complex-3d-stacked-die-design-on-advanced-finfet-node-using-cadence-integrity-3d-ic-platform.html   About GUC "GLOBAL UNICHIP CORP. (GUC) is a market leader in advanced ASIC (application-specific integrated circuit) services. Our comprehensive design services include ‘spec-in’ and SoC (System-on-Chip) integration, physical implementation, advanced packaging technologies (APT), turn-key manufacturing, as well as cutting-edge technologies such as world-class HBM (high-bandwidth memory), die-to-die and die-on-die interconnect IPs. GUC leads the ASIC service ma...