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Press Release

Hsinchu, Taiwan – Apr. 18th, 2024 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that the GLink-3D interface (GUC’s Link for 3D die stacking) for the TSMC 3DFabric SoIC-X 3D stacking platform passed comprehensive silicon testing, validating 3DIC interface hardening flow. The first GUC 3D customer project also passed complete silicon testing, validating a full spectrum of 3D implementation services for AI/HPC/Networking applications.  Typical AI/HPC/Networking chips combine large memory with high performance logic. Logic gains power, speed and size improvement when scaled to the most advanced process while the SRAM scaling gains are moderate. Stacking a logic chiplet at a more advanced process node over an SRAM-dominant chiplet at a SRAM-scalin...